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18 Years Factory 3d Printing Machining - Tungsten Copper WCu Heat Sink – Fotma

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Persisting in "High top quality, Prompt Delivery, Aggressive Price", now we have established long-term cooperation with customers from the two overseas and domestically and get new and aged clients' large comments for Cnc China, Titanium Pipe Price, Black Plated Tungsten, Now we have experienced manufacturing facilities with extra than 100 employees. So we could guarantee short lead time and high quality assurance.
18 Years Factory 3d Printing Machining - Tungsten Copper WCu Heat Sink – Fotma Detail:

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Tungsten copper electronic packaging material has both the low expansion properties of tungsten and the high thermal conductivity properties of copper. What is particularly valuable is that its thermal expansion coefficient and thermal conductivity can be designed by adjusting the composition of the material brought great convenience.

FOTMA uses high-purity and high-quality raw materials, and obtains WCu electronic packaging materials and heat sink materials with excellent performance after pressing, high-temperature sintering and infiltration. 

Tungsten Copper WCu Heat Sink

Advantages of Tungsten Copper (WCu) Electronic Packaging Materials

1. The tungsten copper electronic packaging material has an adjustable thermal expansion coefficient, which can be matched with different substrates (such as: stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.);

2. No sintering activation elements are added to maintain good thermal conductivity;

3. Low porosity and good air tightness;

4. Good size control, surface finish and flatness.

5. Provide sheet, formed parts, also can meet the needs of electroplating.

Copper Tungsten Heat Sink Properties

Material Grade Tungsten Content Wt% Density g/cm3 Thermal Expansion ×10-6  CTE(20℃) Thermal Conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃)/ 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)

Application of Tungsten Copper Heat Sinks

Materials suitable for packaging with high-power devices, such as substrates, lower electrodes, etc.; high-performance lead frames; thermal control boards and radiators for military and civilian thermal control devices.


Product detail pictures:

18 Years Factory 3d Printing Machining - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

18 Years Factory 3d Printing Machining - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

18 Years Factory 3d Printing Machining - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

18 Years Factory 3d Printing Machining - Tungsten Copper WCu Heat Sink  – Fotma detail pictures


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Sticking to the perception of "Creating products of top of the range and earning mates with people today from all over the world", we constantly put the desire of consumers in the first place for 18 Years Factory 3d Printing Machining - Tungsten Copper WCu Heat Sink – Fotma , The product will supply to all over the world, such as: Afghanistan, Muscat, Uruguay, We strive for excellence, constant improvement and innovation, is committed to make us the "customer trust" and the "first choice of engineering machinery accessories brand" suppliers. Choose us, sharing a win-win situation!
  • Cooperate with you every time is very successful, very happy. Hope that we can have more cooperation!
    5 Stars By Claire from Slovakia - 2017.08.18 11:04
    In China, we have many partners, this company is the most satisfying to us, reliable quality and good credit, it is worth appreciation.
    5 Stars By Irma from Kazakhstan - 2017.06.22 12:49
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