CPC material (copper/molybdenum copper/copper composite material)——the preferred material for ceramic tube package base
Cu Mo Cu/Copper Composite Material (CPC) is the preferred material for ceramic tube package base, with high thermal conductivity, dimensional stability, mechanical strength, chemical stability and insulation performance. Its designable thermal expansion coefficient and thermal conductivity make it an ideal packaging material for RF, microwave and semiconductor high-power devices.
Similar to copper/molybdenum/copper (CMC), copper/molybdenum-copper/copper is also a sandwich structure. It is composed of two sub-layers-copper (Cu) wrapped with a core layer-molybdenum copper alloy (MoCu). It has different thermal expansion coefficients in the X region and the Y region. Compared with tungsten copper, molybdenum copper and copper/molybdenum/copper materials, copper-molybdenum-copper-copper (Cu/MoCu/Cu) has higher thermal conductivity and relatively advantageous price.
CPC material (copper/molybdenum copper/copper composite material)—the preferred material for ceramic tube package base
CPC material is a copper/molybdenum copper/copper metal composite material with the following performance characteristics:
1. Higher thermal conductivity than CMC
2. Can be punched into parts to reduce costs
3. Firm interface bonding, can withstand 850℃ high temperature impact repeatedly
4. Designable thermal expansion coefficient, matching materials such as semiconductors and ceramics
5. Non-magnetic
When selecting packaging materials for ceramic tube package bases, the following factors usually need to be considered:
Thermal conductivity: The ceramic tube package base needs to have good thermal conductivity to effectively dissipate heat and protect the packaged device from overheating damage. Therefore, it is important to choose CPC materials with higher thermal conductivity.
Dimensional stability: The package base material needs to have good dimensional stability to ensure that the packaged device can maintain a stable size under different temperatures and environments, and avoid package failure due to material expansion or contraction.
Mechanical Strength: CPC materials need to have sufficient mechanical strength to withstand stress and external impact during assembly and protect packaged devices from damage.
Chemical Stability: Select materials with good chemical stability, which can maintain stable performance under various environmental conditions and are not corroded by chemical substances.
Insulation Properties: CPC materials need to have good insulation properties to protect packaged electronic devices from electrical failures and breakdowns.
CPC high thermal conductivity electronic packaging materials
CPC packaging materials can be divided into CPC141, CPC111 and CPC232 according to their material characteristics. The numbers behind them mainly mean the proportion of the material content of the sandwich structure.
Post time: Jan-17-2025