Professional Design Forging Tungsten - Pure Tungsten Plate Tungsten Sheet – Fotma

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Professional Design Forging Tungsten - Pure Tungsten Plate Tungsten Sheet – Fotma Detail:

Purity 99.95% Tungsten Plates Tungsten Sheets Brief Introduction

1. Material Grade: W1.

2. Tungsten purity: 99.95%.

3. Density: no less than 19.1g/cm3.

4. Size: 0.1mm~100mm thickness x 50-600mm width x 50-1000mm length.

5. Surface: Black, chemical cleaned or machined/ground.

6. Tungsten Sheets Feature: High melting point, High-density, high temperature oxidation resistance, long service life, resistance to corrosion, High quality, workability.

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7. Applications of pure tungsten plate / tungsten sheet: Tungsten plate mainly used in manufacturing electric light source and electric vacuum parts, boats, heatshield and heat bodies in high temperature furnace , Medical diagnosis and treatment equipment ;as a means of high temperature heating element and high temperature structure parts; to product tungsten spiral for vacuum evaporation and making tungsten sputtering target.

Tungsten Sheet Size (max mm)

Thickness	Width	Length
0.05-0.15	100	200
0.15-0.20	205	1000
0.20-0.25	300	1000
0.25-0.30	330	1000
0.30-0.50	350	800
0.50-0.80	300	600
0.80-1.0	300	500
1.0-1.50	400	650
1.50-3.0	300	600
>3.0	300	L

Tungsten Material Properties

There is an increasing demand of tungsten material from the electronics, nuclear, and aerospace industries for materials that maintain reliability under ever-increasing temperature conditions. Because its properties meet these requirements, tungsten also is experiencing an increasing demand.

Characteristics that support the demand for tungsten in many electronics applications are its:

● Strength and stiffness at high temperatures.

● Good thermal conductivity.

● Low thermal expansion.

● Low emissivity.

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Polished Tungsten Plate Size (max mm)

Thickness	Width	Length
3.0-4.0	250	400
4.0-6.0	300	600
6.0-8.0	300	800
8.0-10.0	300	750
10.0-14.0	200	650
>14.0	200	500

Pure Tungsten Plate / Tungsten Sheet Usages

Furnace parts, Semiconductor Base Plates, Components for Electron Tubes, Emission Cathodes for Electron Beam Evaporation, Cathodes and Anodes for Ion Implantation, Tubes / Boats for Sintering of Capacitors, Targets for X-ray Diagnostics, Crucibles, Heating Elements, X-ray Radiation Shielding, Sputtering Targets, Electrodes.

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