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professional factory for 3d Machining - Tungsten Copper WCu Heat Sink – Fotma

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We often persist with the theory "Quality To start with, Prestige Supreme". We are fully committed to delivering our clientele with competitively priced good quality items, prompt delivery and experienced support for Solid Tungsten, Titanium Filler Wire, Rapid Cnc Machining, We have been wanting forwards to creating long-term company interactions with around the world shoppers.
professional factory for 3d Machining - Tungsten Copper WCu Heat Sink – Fotma Detail:

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Tungsten copper electronic packaging material has both the low expansion properties of tungsten and the high thermal conductivity properties of copper. What is particularly valuable is that its thermal expansion coefficient and thermal conductivity can be designed by adjusting the composition of the material brought great convenience.

FOTMA uses high-purity and high-quality raw materials, and obtains WCu electronic packaging materials and heat sink materials with excellent performance after pressing, high-temperature sintering and infiltration. 

Tungsten Copper WCu Heat Sink

Advantages of Tungsten Copper (WCu) Electronic Packaging Materials

1. The tungsten copper electronic packaging material has an adjustable thermal expansion coefficient, which can be matched with different substrates (such as: stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.);

2. No sintering activation elements are added to maintain good thermal conductivity;

3. Low porosity and good air tightness;

4. Good size control, surface finish and flatness.

5. Provide sheet, formed parts, also can meet the needs of electroplating.

Copper Tungsten Heat Sink Properties

Material Grade Tungsten Content Wt% Density g/cm3 Thermal Expansion ×10-6  CTE(20℃) Thermal Conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃)/ 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)

Application of Tungsten Copper Heat Sinks

Materials suitable for packaging with high-power devices, such as substrates, lower electrodes, etc.; high-performance lead frames; thermal control boards and radiators for military and civilian thermal control devices.


Product detail pictures:

professional factory for 3d Machining - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

professional factory for 3d Machining - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

professional factory for 3d Machining - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

professional factory for 3d Machining - Tungsten Copper WCu Heat Sink  – Fotma detail pictures


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We retain bettering and perfecting our merchandise and service. At the same time, we do the job actively to do research and improvement for professional factory for 3d Machining - Tungsten Copper WCu Heat Sink – Fotma , The product will supply to all over the world, such as: Mexico, Southampton, Brazil, We've a skilled sales team, they have mastered the best technology and manufacturing processes, have years of experience in foreign trade sales, with customers able to communicate seamlessly and accurately understand the real needs of customers, providing customers with personalized service and unique merchandise.
  • We always believe that the details decides the company's product quality, in this respect, the company conform our requirements and the goods are meet our expectations.
    5 Stars By Steven from Romania - 2018.11.04 10:32
    It is a very good, very rare business partners, looking forward to the next more perfect cooperation!
    5 Stars By Honorio from kazan - 2018.03.03 13:09
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